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Technical Features


产品名称:Features
产品详细

 the company product features:
Our products adopted:


(1)we take Strictly alloy material  manufacturing process, raw alloy materials had been fully homogenized.before atomizition.

(2) Controlled by computer atomization technology process,It is ensured the solder powder from atomization atmosphere to have   consistency and stability of quality.


(3) The oxidation rate  of  Solder powder has been  Strictly  controled ,It is made the total oxygen content below the Japanese industrial standard range, and the use of special surface packaging technology make solder  powder surface form thin and strong protective film.

产品规格
specification

粒度
particle size

我司产品含氧量
oxygen content
of our company

市场一般产品氧含量
Oxygen content of
buying from market


含氧量减少百分比
the reducing percentage of oxygen content

2.5#

25-63μm

<80ppm

<120ppm

-33%

2.3#

38-63μm

<70ppm

<100ppm

-30%

3#

25-45μm

<90ppm

<120ppm

-25%

4#

20-38μm

<120ppm

<150ppm

-20%

5#

15-25μm

<150ppm

<180ppm

-17%

5.5#

10-30μm

<160ppm

<180ppm

-11%

6#

5-15μm

<300ppm

-

-

7#

2-11μm

<500ppm

-

-

8#

2-8μm

<800ppm

-

-

 




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